Abstract– In this work we use the Timepix chip as a multichannel tester for evaluation of properties of different semiconductor sensors. Different sensors bump-bonded to a Timepix readout chip and exposed to energetic protons with different incident angles and energies have been investigated. Data from each recorded proton track were processed individually. The extent of the charge sharing effect was evaluated along the proton track at different sensor depths. The level of charge sharing is affected by the time of charge collection which is related to the local intensity of the electric field in the sensor. This method can provide a 3D map of the electric field in the whole sensor volume.
The Timepix readout chip can be bump-bonded to different semiconductor sensor materials such as Si, GaAs and CdTe.
B. Measurement setup Protons with energies up to 11.4 MeV hit the Timepix detector, operated in ToT mode, under various angles after Rutherford Backscattering of an accelerator particle beam on a 0.12 mm thick gold foil. The foil is located in a contiguous accelerator chamber, at an angle of 45° with respect to the beam direction. The detector is fully controlled by Fitpix interface  and Pixelman software . Illustration of layout is given in Fig. 2.